The relationship between ceramics and semiconductors: unsung heroes supporting high-tech development.

Semiconductor manufacturing processes require extremely high levels of cleanliness and stability. Metal parts are prone to particulate contamination, and plastic parts cannot withstand high temperatures and plasma corrosion. Precision ceramic materials (such as alumina, zirconium oxide, silicon nitride, and aluminum nitride) perfectly fill this gap.

The core characteristics of ceramic materials include:

High insulation: Prevents current leakage and ensures stable signal transmission;

High temperature resistance: Maintains structural strength even in environments exceeding 1600℃ (alumina ceramic);

Corrosion resistance: Resists chemical etching gases and plasma erosion;

High purity and low precipitation: Avoids secondary contamination of the wafer;

High dimensional accuracy: Meets the equipment assembly requirements of nanoscale processes.

Ceramic components are virtually ubiquitous in semiconductor equipment and manufacturing processes:

It can be said that, from core components to auxiliary parts, precision ceramics are the “structural cornerstone” for the reliable operation of semiconductor equipment.

As chip manufacturing processes advance from 28nm and 7nm to 3nm and even more advanced nodes, the requirements for equipment durability, cleanliness, and thermal management performance become increasingly stringent, driving the continuous evolution of ceramic materials.

High-purity alumina ceramics: purity ≥99.9%, meeting the requirements for ultra-clean vacuum chambers;

High thermal conductivity aluminum nitride ceramics: thermal conductivity as high as 170–280 W/m·K, aiding in the optimization of thermal control systems;

High-toughness zirconia ceramics: used for mechanical moving parts and precision clamping structures;

Silicon nitride ceramics: combining high strength and low thermal expansion coefficient, suitable for complex working conditions.

Haikun New Materials Co., Ltd. has been deeply involved in the industrial ceramics field for over 20 years, focusing on the research and development and processing of non-standard customized ceramic structural components.

The company strictly adheres to the ISO9001:2015 quality system and possesses high-precision CNC grinding, laser cutting, CNC machining, and vacuum sintering processes, providing semiconductor industry customers with integrated solutions from material selection and structural optimization to mass production.

Main service areas:

Ceramic insulating components, guide components, and suction cup bases for semiconductor equipment

Vacuum chamber liners, carrier trays, and sealing and heat insulation components

Precision machining based on supplied materials, drawings, and samples

Advantages of cooperation:

5000+ customer case studies validated

Own 10,000 square meter factory, controllable delivery time

Technical engineering team provides material solution optimization

The development of semiconductor technology relies heavily on the support of ceramic materials.

From an “invisible supporting role” to a “key pillar,” precision ceramics are quietly driving every breakthrough in chip manufacturing.

And Haide Precision Ceramics will continue to contribute to the semiconductor industry’s sustained innovation and reliable operation with high-performance ceramic components.