Silicon Nitride Ceramic Tube

1. Material science-level formula optimization
High-purity Si₃N₄ substrate: purity ≥99.5%, using Y₂O₃-Al₂O₃ composite sintering aid, controllable distribution of grain boundary phase, avoiding high-temperature grain boundary softening.

Gradient structure design: The inner and outer layers of the tube body adopt differentiated density (such as high-density outer layer for corrosion resistance, and porous inner layer for lubricant storage), extending the service life by 30%.

2. Design for extreme environmental adaptability
Thermal shock resistant architecture:

Micro crack deflection technology (through directional arrangement of β-Si₃N₃ whiskers) keeps the structure intact when ΔT≥800℃.

Pre-set metallized transition layer (Mo-Mn method) at the pipe end to match the thermal expansion coefficient of the metal flange to eliminate the risk of cracking.

Corrosion resistance and strengthening:

Surface laser remelting treatment to form a nanocrystalline SiO₂ passivation film, resistant to pH1-13 acid and alkali corrosion (except HF).

3. Precision engineering structure
Extra tolerance control:

Inner diameter tolerance ±0.005mm (air bearing level), roundness ≤0.003mm, suitable for semiconductor wafer transmission.

Inner wall mirror polishing (Ra≤0.05μm) reduces fluid resistance and avoids particle deposition.

Special-shaped integrated design:

Supports embedded cooling channels, porous permeable structures (such as fuel cell bipolar plate gas path), and thread/flange integrated molding.

1. Semiconductor and electronics industry
Wafer manufacturing equipment:

Diffusion furnace tubes, CVD reactor liners (replacing quartz, lifespan increased by 3 times)

Plasma etching machine components (resistant to Cl₂/F-based plasma corrosion)

Power electronics heat dissipation:

IGBT module ceramic substrate (thermal conductivity 30 W/m·K, insulation withstand voltage > 15 kV/mm)

High-frequency circuit packaging (5G base station RF devices)

Industry pain point solutions
▸ Solve the problem of high-temperature deformation of quartz tubes and metal parts contaminating wafers.

2. Energy and environmental protection technology
Fuel cells:

Bipolar plates (conductive Si₃N₄, resistant to hydrogen embrittlement, lifespan > 40,000 hours)

Acid-resistant sealing rings for electrolytic cells (stable under pH=1~14 environment)

Solar energy/nuclear energy:

Thermal field components of polysilicon ingot furnaces (resistant to 1600℃ silicon melt erosion)

Nuclear reactor neutron absorption rod cladding (anti-radiation swelling)

Industry pain point solutions
▸ Replace graphite materials to avoid oxidation and pulverization; more resistant to molten salt corrosion than metals.

3. Aerospace and military industry
Aerospace engines:

Turbine blade ceramic matrix composite (CMC) reinforcement phase

Combustion chamber igniter insulation (resistant to 1500℃ thermal shock)

Spacecraft:

Rocket nozzle throat lining (resistant to 3000℃ gas scour)

Satellite bearings (self-lubricating in vacuum environment, maintenance-free)

Industry pain point solutions
▸ 40% lighter than metal, improve thrust-to-weight ratio; solve material failure caused by extreme temperature differences in space.